Apple, Samsung working on heat-pipe cooling for upcoming phones?

Apple, Samsung working on heat-pipe cooling for upcoming phones?
According to Digitimes, Apple and Samsung have begun developing ultra-thin heat pipes for their upcoming smartphones, with the potential to reveal "heat pipe-adopted models in the fourth quarter."

The companies would not be the first to launch such a model, as NEC just unveiled their Medias X06E, a smartphone with a 4.7-inch 1,280x720 OLED display, a 1.7GHz Qualcomm Snapdragon S4 Pro 4 processor and heat pipes for improved cooling.



Digi says the "conventional graphite plus foil cooling method is no longer able to dissipate enough heat in modern smartphone models efficiently" mainly thanks to the standardization of LTE chips.

Ultrabooks currently use heat pipes with diameters of 1-1.2mm, but NEC's has a tiny 0.6mm diameter. Due to Apple's tiny screens, that may have to be even smaller for upcoming devices.

Written by: Andre Yoskowitz @ 21 Jun 2013 11:41
Tags
Heat Pipe Cooling
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  • 4 comments
  • dEwMe

    I wanna see someone set up water cooling on this...lol

    Just my $0.02,

    dEwMe

    21.6.2013 14:44 #1

  • Jemborg

    I had no idea heat pipes could work at such small diameters.

    Its a lot easier being righteous than right.


    21.6.2013 15:04 #2

  • A5J4DX

    nice!

    22.6.2013 20:03 #3

  • cart0181

    Save the chip, burn your leg off.

    24.6.2013 01:29 #4

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